TY - JOUR
TI - A new fractional thermal model for the Cu/Low-k interconnects in nanometer integrated circuit
AU - Zhang Pei-Ling
AU - Wang Kang-Jia
JN - Thermal Science
PY - 2022
VL - 26
IS - 3
SP - 2413
EP - 2418
PT - Article
AB - In this paper, the Cu/Low-k interconnects in a nanoscale integrated circuit  are considered. A new fractal conventional heat transfer equation is  suggested using He's fractal derivative. The two-scale transform method is  applied for solving the equation approximately. The new findings, which the  traditional differential models can never reveal, shed a bright light on  the optimal design of a nanoscale integrated circuit.