TY - JOUR TI - Thermal optimization of a 3-D integrated circuit AU - Wang Kang-Jia AU - Hua Chu-Xia AU - Liang Yan-Hong JN - Thermal Science PY - 2020 VL - 24 IS - 4 SP - 2615 EP - 2620 PT - Article AB - In a 3-D integrated circuit the heat source distribution has a huge effect on the temperature distribution, so an optimal heat source distribution is needed. This paper gives a numerical approach to its thermal optimization, the result can be used for 3-D integrated circuit optimal design.