TY - JOUR
TI - Three-dimensional simulation of controlled cooling of electronic component by natural and mixed convection
AU - Belarche Lahoucine
AU - Abourida Btissam
AU - Doghmi Hicham
AU - Sannad Mohamed
AU - Ouzaouit Meryem
JN - Thermal Science
PY - 2021
VL - 25
IS - 4
SP - 2565
EP - 2577
PT - Article
AB - The present study is the 3-D simulation of cooling control of electronic component, by natural convection and mixed convection in a cubical enclosure, filled with air. The heating square portion similar to the integrated electronic device and releasing a constant flux is placed on the right vertical wall of the enclosure. The same wall has, in its upper part, an extractor, while the rest of the considered wall is adiabatic. Its opposite wall has an opening maintained at a cold temperature. For low temperatures, the cooling of the component is provided by natural convection, however, in the case of strong temperature gradients, the extractor, operating at variable velocity, allows the evacuation of the dissipated heat. The cooling control of the component, the temperature distribution as well as the flow of fluid in the cavity is studied according to the governing parameters, namely the Rayleigh and Reynolds numbers. The obtained results show that the control cooling of the electronic components has a great industrial interest compared to the continuous cooling (ventilation), by an optimal choice of the governing parameters and the material constituting the components.