TY - JOUR
TI - Thermal performance evaluation of different passive devices for electronics cooling
AU - Krambeck Larissa
AU - Nishida Felipe Baptista
AU - De Aguiar Vinícius Marrone
AU - Dias Dos Santos Paulo Henrique
AU - Alves Thiago Antonini
JN - Thermal Science
PY - 2019
VL - 23
IS - 2
SP - 1151
EP - 1160
PT - Article
AB - The advent of modern electronic technology lead to miniaturization and high  power density of electronic devices, then the existing electronic cooling  techniques cannot be used, directly affecting the performance, cost, and  reliability of electronic devices. Thus, the thermal management of  electronic packaging has become a key technique in many products. Passive  heat transfer devices can be a good alternative to the stabilization of  electronic devices temperature. In this research, an experimental evaluation  of the thermal performance of four different passive devices was  accomplished. The considered devices were a rod, a thermosyphon, a heat pipe  with a metal screen as the capillary structure, and a heat pipe with  microgrooves. The heat pipe is a highly efficient device that carries large  amounts of power with a small temperature difference. The heat pipe consists  of the involucre, the working fluid, and the capillary structure. The  thermosyphon is a kind of heat pipe assisted by gravity. In other words, it  has no wick structure to return the working fluid. The devices were made of  copper with a total length of 200 mm and an outer diameter of 9.45 mm. The  thermosyphon and the heat pipes used deionized water as working fluid with a  filling ratio of 60% of the evaporator volume. The devices were tested in  vertical and horizontal positions under thermal loads between 5 and 45 W.  All the devices have operated satisfactorily when tested in accordance with  the behavior of the thermal resistance. The heat pipes were the best among  the tested devices and the best position was vertical.