TY - JOUR
TI - Optimization of the thermal performance of multi-layer silicon microchannel heat sinks
AU - Xu Shanglong
AU - Wu Yihao
AU - Cai Qiyu
AU - Yang Lili
AU - Li Yue
JN - Thermal Science
PY - 2016
VL - 20
IS - 6
SP - 2001
EP - 2013
PT - Article
AB - The objective is to optimize the configuration sizes and thermal performance  of a multilayer silicon microchannel heat sink by the thermal resistance  network model. The effect of structural parameter on the thermal resistance  is analyzed by numercal simulation. Taking the thermal resistance as an  objective function, a nonlinear and multi-constrained optimization model are  proposed for the silicon microchannel heat sink in electronic chips cooling.  The sequential quadratic programming (SQP) method is used to do the  optimization design of the configuration sizes of the microchannel. For the  heat sink with the size of 20mm×20mm and the power of 400 W, the optimized  microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm,  respectively, and its corresponding total thermal resistance for whole  microchannel heat sink is 0.0424 K/W.