THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

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Experimental investigation on thermal performance of plate fin heat sinks with nano PCM

ABSTRACT
In this study, electronic devices are experimentally examined to improve the thermal performance of the plate fin heat sink. It is performed on the basis of the paraffin wax used as a phase change material filled in a heat sink plate. The aim of the study is to select the most efficient SiO2 volume fraction in paraffin wax to be filled in a heat sink with a plate finish. SiO2 is considered to be a nano particle and 1 percent, 3 percent and 5 percent of SiO2 volume is selected for the preparation of nano PCM. At the base of the plate fin heat sink, a constant heat source is applied. A plate fin heat sink is selected to quantify the effect of Nano PCM as a reference heat sink. The effect of thermal performance of heat sinks was examined using a different volume fraction of nano PCM. The thermal performance comparison is carried out with and without PCM for the plate heat sink of Reynolds number 4000 - 16000. In order to find the effect of PCM and variable Reynolds number, the investigation of the plate fin heat sink is examined. The results showed that the inclusion of PCM (Paraffin wax and SiO2-based nano PCM) in the heat sink plate provides better cooling performance and keeps the desired temperature. The results show that the heat sink based on PCM enriched with nano particles provided better thermal performance compared to the heat sink with a simple PCM. The thermal performance of the SiO2 based nano PCM 3 percent volume fraction is better than 1 percent volume fraction and the heat sinks of the plate finish.
KEYWORDS
PAPER SUBMITTED: 1970-01-01
PAPER REVISED: 2019-05-13
PAPER ACCEPTED: 2019-06-01
PUBLISHED ONLINE: 2019-10-06
DOI REFERENCE: https://doi.org/10.2298/TSCI190411357A
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