THERMAL SCIENCE

International Scientific Journal

Aysha Maryam Siddiqui

,

Waqas Arshad

,

Hafiz Muhammad Ali

,

Muzaffar Ali

,

Muhammad Ali Nasir

EVALUATION OF NANOFLUIDS PERFORMANCE FOR SIMULATED MICROPROCESSOR

ABSTRACT
In this investigation, deionized water was used as base fluid. Two different types of nanoparticles, namely Al2O3 and Cu were used with 0.251% and 0.11% volumetric concentrations in the base fluid, respectively. Nanofluids cooling rate for flat heat sink used to cool a microprocessor was observed and compared with the cooling rate of pure water. An equivalent microprocessor heat generator i. e. a heated Cu cylinder was used for controlled experimentation. Two surface heaters, each of 130 W power, were responsible for heat generation. The experiment was performed at the flow rates of 0.45, 0.55, 0.65, 0.75, and 0.85 liter per minute. The main focus of this research was to minimize the base temperature and to increase the overall heat transfer coefficient. The lowest base temperature achieved was 79.45 oC by Al2O3 nanofluid at Reynolds number of 751. Although, Al2O3-water nanofluid showed superior performance in overall heat transfer coefficient enhancement and thermal resistance reduction as compared to other tested fluids. However, with the increase of Reynolds number, Cu-water nanofluid showed better trends of thermal enhancement than Al2O3-water nanofluid, particularly at high Reynolds number ranges.
KEYWORDS
nanofluid, specific heat, thermal capacity, enhancement
PAPER SUBMITTED: 2015-01-31
PAPER REVISED: 2015-10-15
PAPER ACCEPTED: 2015-10-16
PUBLISHED ONLINE: 2015-11-15
DOI REFERENCE: https://doi.org/10.2298/TSCI150131159S
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2017, VOLUME 21, ISSUE Issue 5, PAGES [2227 - 2236]
REFERENCES
  1. Tuckerman, D. B., Pease, R. F. W., High-Performance Heat Sinking for VLSI, IEEE Electron Device Letters EDL, 2 (1981), 5, pp. 126-129
  2. Schubert, K., et al., Microstructure Devices for Applications in Thermal and Chemical Process Engineering, Microscale Thermophysical Engineering, 5 (2001), 1, pp. 17-39
  3. Kandlikar, S. G., A Roadmap for Implementing Minichannels in Refrigeration and Air-Conditioning Systems Current Status and Future Directions, Heat Transfer Engineering, 28 (2007), 12, pp. 973-985
  4. Sobhan, C. B., Peterson, G. P., Microscale and Nanoscale Heat Transfer Fundamentals and Engineering Applications, CRC Press, Boca Raton, Fla., USA, 2008
  5. Xie, X. L., et al., Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water Cooled Minichannel Heat Sink, J. Electron. Packag., 129 (2007), 3, pp. 247-255
  6. Steinke, M. E., Kandlikar, S. G., Review of Single-Phase Heat Transfer Enhancement Techniques for Application in Microchannels, Minichannels and Microdevices, Heat and Technology, 22 (2004), 2, pp. 3-11
  7. Pak, B. C., Cho, Y. I., Hydrodynamic and Heat Transfer Study of Dispersed Fluids with Submicron Metallic Oxide Particles, Exp. Heat Transfer, 11 (1998), 2, pp. 151-170
  8. Ho, C. J., et al., An Experimental Investigation of Forced Convective Cooling Performance of a Microchannel Heat Sink with Al2O3/Water Nanofluid, Appl. Therm. Eng., 30 (2010), 2-3, pp. 96-103
  9. Lee, S., et al., Measuring Thermal Conductivity of Fluids Containing Oxide Nanoparticles, J. Heat Transfer, 121 (1999), 2, pp. 280-290
  10. Lee, J., Mudawar, I., Assessment of the Effectiveness of Nanofluids for Single Phase and Two Phase Heat Transfer in Microchannels, Int. J. Heat Mass Transfer, 50 (2007), 3-4, pp. 452-463
  11. Sohel, M. R., et al., An Experimental Investigation of Heat Transfer Enhancement of a Minichannel Heat Sink Using Al2O3-H2O Nanofluid, International Journal of Heat and Mass Transfer, 74 (2014), July, pp. 164-172
  12. Ho, C. J., et al., An Experimental Investigation of Forced Convective Cooling Performance of a Microchannel Heat Sink with Al2O3/Water Nanofluid, Applied Thermal Engineering, 30 (2010), 2-3, pp. 96-103
  13. Anoop, K., et al., Experimental Study of Forced Convective Heat Transfer of Nanofluids in a Microchannel, International Communications in Heat and Mass Transfer, 39 (2012), 9, pp. 1325-1330
  14. Rafati, M., et al., Applications of Nanofluids in Computer Cooling Systems (Heat Transfer Performance of Nanofluids), Appl. Therm. Eng., 45-46 (2012), Dec., pp. 9-14
  15. Dixit, T., Ghosh, I., Low Reynolds Number Thermo-Hydraulic Characterization of Offset and Diamond Minichannel Metal Heat Sinks, Exp. Therm. Fluid Science, 51 (2013), Nov., pp. 227-238
  16. Peyghambarzadeh, S. M., et al., Performance of Water Based CuO and Al2O3 Nanofluids in a Cu–Be Alloy Heat Sink with Rectangular Microchannels, Ener. Conversion Management, 86 (2014), Oct., pp. 28-38
  17. Corcione, M., Empirical Correlating Equations for Predicting the Effective Thermal Conductivity and Dynamic Viscosity of Nanofluids, Energy Conversion and Management, 52 (2011), 1, pp. 789-793
  18. Jajja, S. A., et al., Water Cooled Minichannel Heat Sinks for Microprocessor Cooling: Effect of Fin Spacing, Applied Thermal Engineering, 64 (2014), 1-2, pp. 76-82
  19. Keblinski, P., et al., Mechanisms of Heat Flow in Suspensions of Nano-Sized Particles (Nanofluids), International Journal of Heat and Mass Transfer, 45 (2002), 4, pp. 855-863
  20. Naphon, P., Nakharintr, L., Heat Transfer of Nanofluids in the Mini-Rectangular Fin Heat Sinks, International Communications in Heat and Mass Transfer, 40 (2013), Jan., pp. 25-31
  21. Shenoy, S., et al., Minichannels with Carbon Nanotube Structured Surfaces for Cooling Applications, International Journal of Heat and Mass Transfer, 54 (2011), 25-26, pp. 5379-5385
  22. Hung, T. C., et al., Thermal Performance Analysis of Porous-Microchannel Heat Sinks with Different Configuration Designs, International Journal of Heat and Mass Transfer, 66 (2013), Nov., pp. 235-243
  23. Yang, K. S., et al., On the Heat Transfer Characteristics of Heat Sinks: Influence of Fin Spacing at Low Reynolds Number Region, International Journal of Heat and Mass Transfer, 50 (2007), 13-14, pp. 2667-2674
  24. Rea, U., et al., Laminar Convective Heat Transfer and Viscous Pressure Loss of Alumina-Water and Zirconia-Water Nanofluids, Int. J. Heat Mass Transfer, 52 (2009), 7-8, pp. 2042-2048
  25. Batchelor, G. K., Brownian Diffusion of Particles with Hydrodynamic Interaction, J. Fluid Mech., 74 (1976), 1, pp. 1-29
  26. Kline, S. J., McClintock, F. A., Describing Uncertainties in Single-Sample Experiments, Mech. Eng., 75 (1953), 1, pp. 3-8
PDF VERSION [DOWNLOAD]
Evaluation of nanofluids performance for simulated microprocessor

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence