TY - JOUR TI - Thermal management of the through silicon vias in 3-D integrated circuits AU - Wang Kang-Jia AU - Hua Chu-Xia AU - Sun Hong-Chang JN - Thermal Science PY - 2019 VL - 23 IS - 4 SP - 2157 EP - 2162 PT - Article AB - The through silicon via technology is a promising and preferred way to realize the reliable interconnection for 3-D integrated circuit integration. However, its size and the property of the filled-materials are two factors affecting the thermal behavior of the integrated circuits. In this paper, we design 3-D integrated circuits with different through silicon via models and analyze the effect of different material-filled through silicon vias, aspect ratio and thermal conductivity of the dielectric on the steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for through silicon vias in 3-D integrated circuits.