TY - JOUR
TI - Thermal model for 3-D integrated circuits with integrated MLGNR-based through silicon via
AU - Xu Peng
AU - Pan Zhong-Liang
JN - Thermal Science
PY - 2020
VL - 24
IS - 3
SP - 2067
EP - 2075
PT - Article
AB - This paper applies the multi-layer graphene nanoribbon as a new prospective filler material for through silicon via to solve the complex heat problems in the 3-D integrated circuits. An equivalent thermal model for 3-D integrated circuits with the MLGNR-based through silicon via is presented in this work, which take lateral heat transfer of through silicon via into account. The experimental results show that the heat transfer performance of MLGNR-based through silicon via is better than the conventional Cu-based through silicon via. Furthermore, it is found that the temperature predicted by the proposed model are in good accordance with the ANSYS simulation, and the maximum relative deviation is less than 4.0%