TY - JOUR
TI - Thermal management of the hotspots in 3-D integrated circuits
AU - Wang Kang-Jia
AU - Sun Hong-Chang
AU - Li Cui-Ling
AU - Wang Guo-Dong
AU - Zhu Hong-Wei
JN - Thermal Science
PY - 2018
VL - 22
IS - 4
SP - 1685
EP - 1690
PT - Article
AB - Vertical integration for microelectronics possesses significant challenges  due to its fast dissipation of heat generated in multiple device planes.  This paper focuses on thermal management of a 3-D integrated circuit, and  micro-channel cooling is adopted to deal with the 3-D integrated  circuitthermal problems. In addition, thermal through-silicon vias are also  used to improve the capacity of heat trans-mission. It is found that  combination of microchannel cooling and thermal through-silicon vias can  remarkably alleviate the hotspots. The results presented in this paper are  expected to aid in the development of thermal design guidelines for 3-D  integrated circuits.