TY - JOUR
TI - An analytical thermal model for three-dimensional integrated circuits with integrated micro-channel cooling
AU - Wang Kang-Jia
AU - Sun Hong-Chang
AU - Pan Zhong-Liang
JN - Thermal Science
PY - 2017
VL - 21
IS - 4
SP - 1601
EP - 1606
PT - Article
AB - An analytical thermal model is developed for N-diestacked chips with  integrated microchannels cooling. The model is implemented with some  mathematical software. Comparison of the temperature predicted by the  proposed model with some CFD software numerical results shows excellent  agreement, and the maximal relative error is less than 4.0%.