TY - JOUR
TI - THERMAL BEHAVIOR OF ELECTROSPUN GELATIN AND CHITOSAN COMPLEX
AU - Qi Meng-Jie
AU - Qian Yong-Fang
AU - Zhao Yu-Ping
AU - Wei Ju
JN - Thermal Science
PY - 2015
VL - 19
IS - 4
SP - 1323
EP - 1326
PT - Article
AB - This paper studied the thermal behavior of gelatin, chitosan, and their complex. Thermal stability was analyzed by thermogravimetric analysis, and the results showed that gelatin and chitosan raw materials exhibited two decomposition stages while as-electrospun nanofibrous mats had three decomposition stages. Moreover, chitosan raw material had better thermal stability than gelatin. However, its electrospun partner revealed its opposite trend. X-ray diffraction was used to analyze the crystalline property and the result showed that the crystallinity decreased due to the interaction with the solvents, and thus the thermal stability sharply decreased. In addition, incorporation of gelatin could improve the
thermal stability of chitosan.