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OPTIMIZATION OF THE THERMAL PERFORMANCE OF MULTI-LAYER SILICON MICROCHANNEL HEAT SINKS

ABSTRACT
The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm×20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.
KEYWORDS
PAPER SUBMITTED: 2014-12-13
PAPER REVISED: 2015-07-01
PAPER ACCEPTED: 2015-08-23
PUBLISHED ONLINE: 2015-09-06
DOI REFERENCE: https://doi.org/10.2298/TSCI141213122X
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2016, VOLUME 20, ISSUE 6, PAGES [2001 - 2013]
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© 2019 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence