THERMAL SCIENCE

International Scientific Journal

ENHANCEMENT OF HEAT TRANSFER COEFFICIENT MULTI-METALLIC NANOFLUID WITH ANFIS MODELING FOR THERMOPHYSICAL PROPERTIES

ABSTRACT
Cu and Zn-water nanofluid is a suspension of the Cu and Zn nanoparticles with the size 50 nm in the water base fluid for different volume fractions to enhance its Thermophysical properties. The determination and measuring the enhancement of Thermophysical properties depends on many limitations. Nanoparticles were suspended in a base fluid to prepare a nanofluid. A coated transient hot wire apparatus was calibrated after the building of the all systems. The vibro-viscometer was used to measure the dynamic viscosity. The measured dynamic viscosity and thermal conductivity with all parameters affected on the measurements such as base fluids thermal conductivity, volume factions, and the temperatures of the base fluid were used as input to the Artificial Neural Fuzzy inference system to modeling both dynamic viscosity and thermal conductivity of the nanofluids. Then, the ANFIS modeling equations were used to calculate the enhancement in heat transfer coefficient using CFD software. The heat transfer coefficient was determined for flowing flow in a circular pipe at constant heat flux. It was found that the thermal conductivity of the nanofluid was highly affected by the volume fraction of nanoparticles. A comparison of the thermal conductivity ratio for different volume fractions was undertaken. The heat transfer coefficient of nanofluid was found to be higher than its base fluid. Comparisons of convective heat transfer coefficients for Cu and Zn nanofluids with the other correlation for the nanofluids heat transfer enhancement are presented. Moreover, the flow demonstrates anomalous enhancement in heat transfer nanofluids.
KEYWORDS
PAPER SUBMITTED: 2012-11-28
PAPER REVISED: 2013-05-10
PAPER ACCEPTED: 2013-09-04
PUBLISHED ONLINE: 2013-11-16
DOI REFERENCE: https://doi.org/10.2298/TSCI121128139B
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2015, VOLUME 19, ISSUE 5, PAGES [1613 - 1620]
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